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bookmarks

publications

(3)

• Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking.
  Phil Jacobs and Aamir Zia and Okan Erdogan and Paul M. Belemjian and Peng Jin and Jin Woo Kim and Mike Chu and Russell P. Kraft and John F. McDonald ICCD 202-207 (2007)
  to dblp by dblp on 2008-09-22 00:00:00
  | URL | BibTeX  
• Predicting the Performance of a 3D Processor-Memory Chip Stack.
  Philip Jacob and Okan Erdogan and Aamir Zia and Paul M. Belemjian and Russell P. Kraft and John F. McDonald IEEE Design & Test of Computers 22 540-547 (2005)
  to dblp by dblp on 2006-04-27 00:00:00
  | URL | BibTeX  
• 3D direct vertical interconnect microprocessors test vehicle.
  John Mayega and Okan Erdogan and Paul M. Belemjian and Kuan Zhou and John F. McDonald and Russell P. Kraft ACM Great Lakes Symposium on VLSI 141-146 (2003)
  to dblp by dblp on 2006-02-10 00:00:00
  | URL | BibTeX