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Evaluation of the thermal and hydraulic performances of a very thin sintered copper flat heat pipe for 3D microsystem packages

Slaska Tzanova and Lora Kamenova and Yvan Avenas and Christian Schaeffer CoRR abs/0802.3107 (2008)
to dblp by dblp on 2008-03-03 00:00:00
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New assembling technique for BGA packages without thermal processes.

Valentin Videkov and Slavka Tzanova and Radosvet Arnaudov and Nikolai Iordanov Microelectronics Reliability 41 611-615 (2001)
to dblp by dblp on 2007-03-25 00:00:00
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