BibSonomy :: author :: Verbinnen

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Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.
Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, and Eric Beyne. 3DIC, page 1-4. IEEE, (2011)
Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, and Eric Beyne. 3DIC, page 1-4. IEEE, (2011)
8 months ago
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TSV metrology and inspection challenges.
Ramakanth Alapati, Youssef Travaly, Jan Van Olmen, Ricardo Cotrin Teixeira, Jan Vaes, Marc van Cauwenbergh, Anne Jourdain, Greet Verbinnen, Gino Marcuccilli, Glenn Florence, Shay Wolfling, Christine Pelissier, Haiping Zhang, Jaydeep Sinha, Andreas Machura, and Irfan Malik. 3DIC, page 1-4. IEEE, (2009)
Ramakanth Alapati, Youssef Travaly, Jan Van Olmen, Ricardo Cotrin Teixeira, Jan Vaes, Marc van Cauwenbergh, Anne Jourdain, Greet Verbinnen, Gino Marcuccilli, Glenn Florence, Shay Wolfling, Christine Pelissier, Haiping Zhang, Jaydeep Sinha, Andreas Machura, and Irfan Malik. 3DIC, page 1-4. IEEE, (2009)
2 years and 10 months ago
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CerBeruS: A System Supporting the Sequential Screening Process.
Michael F. M. Engels, Theo Thielemans, Danny Verbinnen, Jan P. Tollenaere, and Rudi Verbeeck. Journal of Chemical Information and Computer Sciences 40(2):241-245 (2000)
Michael F. M. Engels, Theo Thielemans, Danny Verbinnen, Jan P. Tollenaere, and Rudi Verbeeck. Journal of Chemical Information and Computer Sciences 40(2):241-245 (2000)
10 years ago
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