@inproceedings{conf/3dic/ToyodaSHMSHMS11,
  added-at = {2012-09-05T00:00:00.000+0200},
  author = {Toyoda, S. and Shibata, A. and Harada, M. and Murayama, T. and Sakuishi, T. and Hatanaka, M. and Morikawa, Y. and Suu, K.},
  biburl = {http://www.bibsonomy.org/bibtex/24aece5a19afe2a5357144fbc3035a9d1/dblp},
  booktitle = {3DIC},
  crossref = {conf/3dic/2011},
  editor = {Koyanagi, Mitsumasa and Kada, Morihiro},
  ee = {http://dx.doi.org/10.1109/3DIC.2012.6262945},
  interhash = {89e1a43545290121cacd9ca301dfe9c0},
  intrahash = {4aece5a19afe2a5357144fbc3035a9d1},
  isbn = {978-1-4673-2189-1},
  keywords = {dblp},
  pages = {1-5},
  publisher = {IEEE},
  timestamp = {2012-09-05T00:00:00.000+0200},
  title = {TSV process solution for 3D-IC.},
  url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#ToyodaSHMSHMS11},
  year = 2011
}