@inproceedings{conf/3dic/HayashiKTSSOMTB11,
  added-at = {2012-09-05T00:00:00.000+0200},
  author = {Hayashi, Taro and Kondo, Kazuo and Takeuchi, Minoru and Suzuki, Yushi and Saito, Takeyasu and Okamoto, Naoki and Marunaka, Masao and Tsuchiya, Takayuki and Bunya, Masaru},
  biburl = {http://www.bibsonomy.org/bibtex/24fce725ed28270b2147642b6f0d6f164/dblp},
  booktitle = {3DIC},
  crossref = {conf/3dic/2011},
  editor = {Koyanagi, Mitsumasa and Kada, Morihiro},
  ee = {http://dx.doi.org/10.1109/3DIC.2012.6262983},
  interhash = {34637d78f00ed1141a4f3bca2ac074eb},
  intrahash = {4fce725ed28270b2147642b6f0d6f164},
  isbn = {978-1-4673-2189-1},
  keywords = {dblp},
  pages = {1-4},
  publisher = {IEEE},
  timestamp = {2012-09-05T00:00:00.000+0200},
  title = {3D interconnected technology by high speed copper electrodeposition using diallylamine levelers.},
  url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#HayashiKTSSOMTB11},
  year = 2011
}