%0 Conference Paper %1 conf/3dic/HuangTCSLCCHCTC13 %A Huang, Yan-Pin %A Tzeng, Ruoh-Ning %A Chien, Yu-San %A Shy, Ming-Shaw %A Lin, Teu-Hua %A Chen, Kuo-Hua %A Chuang, Ching-Te %A Hwang, Wei %A Chiu, Chi-Tsung %A Tong, Ho-Ming %A Chen, Kuan-Neng %B 3DIC %D 2013 %I IEEE %K dblp %P 1-5 %T Low temperature (<180 °C) bonding for 3D integration. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#HuangTCSLCCHCTC13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/HuangTCSLCCHCTC13, added-at = {2017-09-16T00:00:00.000+0200}, author = {Huang, Yan-Pin and Tzeng, Ruoh-Ning and Chien, Yu-San and Shy, Ming-Shaw and Lin, Teu-Hua and Chen, Kuo-Hua and Chuang, Ching-Te and Hwang, Wei and Chiu, Chi-Tsung and Tong, Ho-Ming and Chen, Kuan-Neng}, biburl = {https://www.bibsonomy.org/bibtex/23fd249a6bee78cec805ec8afda7bbad5/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702319}, interhash = {0c3b7316a09d0f729d96710af94246c8}, intrahash = {3fd249a6bee78cec805ec8afda7bbad5}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-5}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {Low temperature (<180 °C) bonding for 3D integration.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#HuangTCSLCCHCTC13}, year = 2013 }