Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test.
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%0 Journal Article
%1 journals/mr/LinHCWWLWHLD15
%A Lin, Hsiu-Min
%A Ho, Cheng-Ying
%A Chen, Wen-Lin
%A Wu, Yi-Hsin
%A Wang, De-Hui
%A Lin, Jun-Ren
%A Wu, Yu-Hui
%A Hong, Huei-Cheng
%A Lin, Zhi-Wei
%A Duh, Jenq-Gong
%D 2015
%J Microelectron. Reliab.
%K dblp
%N 1
%P 231-237
%T Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test.
%U http://dblp.uni-trier.de/db/journals/mr/mr55.html#LinHCWWLWHLD15
%V 55
@article{journals/mr/LinHCWWLWHLD15,
added-at = {2020-02-22T00:00:00.000+0100},
author = {Lin, Hsiu-Min and Ho, Cheng-Ying and Chen, Wen-Lin and Wu, Yi-Hsin and Wang, De-Hui and Lin, Jun-Ren and Wu, Yu-Hui and Hong, Huei-Cheng and Lin, Zhi-Wei and Duh, Jenq-Gong},
biburl = {https://www.bibsonomy.org/bibtex/2bdd9652b8cdefddfc2c39f58543529cd/dblp},
ee = {https://doi.org/10.1016/j.microrel.2014.09.003},
interhash = {48ddda5521b79522e09343645f15c789},
intrahash = {bdd9652b8cdefddfc2c39f58543529cd},
journal = {Microelectron. Reliab.},
keywords = {dblp},
number = 1,
pages = {231-237},
timestamp = {2020-02-25T13:25:23.000+0100},
title = {Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr55.html#LinHCWWLWHLD15},
volume = 55,
year = 2015
}
