%0 Journal Article %1 journals/mr/JohanssonBJDL14 %A Johansson, Jonas %A Belov, Ilja %A Johnson, Erland %A Dudek, Rainer %A Leisner, Peter %D 2014 %J Microelectron. Reliab. %K dblp %N 11 %P 2523-2535 %T Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments. %U http://dblp.uni-trier.de/db/journals/mr/mr54.html#JohanssonBJDL14 %V 54

@article{journals/mr/JohanssonBJDL14, added-at = {2020-02-22T00:00:00.000+0100}, author = {Johansson, Jonas and Belov, Ilja and Johnson, Erland and Dudek, Rainer and Leisner, Peter}, biburl = {https://www.bibsonomy.org/bibtex/2c93c44dc43136d2a39a1467fc13564a3/dblp}, ee = {https://doi.org/10.1016/j.microrel.2014.06.007}, interhash = {8a837361ca897271fcc89d40b2ccebeb}, intrahash = {c93c44dc43136d2a39a1467fc13564a3}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 11, pages = {2523-2535}, timestamp = {2020-02-25T13:28:46.000+0100}, title = {Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#JohanssonBJDL14}, volume = 54, year = 2014 }