%0 Conference Paper %1 conf/cicc/SadanaCWSSB15 %A Sadana, D. K. %A Cheng, C.-W. %A Wacaser, B. %A Spratt, W. %A Shiu, K. T. %A Bedell, Stephen W. %B CICC %D 2015 %I IEEE %K dblp %P 1-6 %T Materials challenges for III-V/Si co-integrated CMOS. %U http://dblp.uni-trier.de/db/conf/cicc/cicc2015.html#SadanaCWSSB15 %@ 978-1-4799-8682-8

@inproceedings{conf/cicc/SadanaCWSSB15, added-at = {2017-05-17T00:00:00.000+0200}, author = {Sadana, D. K. and Cheng, C.-W. and Wacaser, B. and Spratt, W. and Shiu, K. T. and Bedell, Stephen W.}, biburl = {https://www.bibsonomy.org/bibtex/2894b74e385b380ac45966db33770a6fb/dblp}, booktitle = {CICC}, crossref = {conf/cicc/2015}, ee = {https://doi.org/10.1109/CICC.2015.7338398}, interhash = {1977585ecb90c4fd831a7b5e1018ea8d}, intrahash = {894b74e385b380ac45966db33770a6fb}, isbn = {978-1-4799-8682-8}, keywords = {dblp}, pages = {1-6}, publisher = {IEEE}, timestamp = {2019-10-17T23:08:50.000+0200}, title = {Materials challenges for III-V/Si co-integrated CMOS.}, url = {http://dblp.uni-trier.de/db/conf/cicc/cicc2015.html#SadanaCWSSB15}, year = 2015 }