Meta data
- BibTeX key
- conf/3dic/ChenLHCTCCCCHLLKK13
- entry type
- inproceedings
- booktitle
- 3DIC
- year
- 2013
- pages
- 1-5
- publisher
- IEEE
- crossref
- conf/3dic/2013
- ee
- https://doi.org/10.1109/3DIC.2013.6702335
- isbn
- 978-1-4673-6484-3
- url
- http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#ChenLHCTCCCCHLLKK13
Tags
Users
Comments and Reviewsshow / hide
Cite this publication
More citation styles
- please select -%0 Conference Paper
%1 conf/3dic/ChenLHCTCCCCHLLKK13
%A Chen, Jui-Chin
%A Lau, John H.
%A Hsu, Tzu-Chien
%A Chen, Chien-Chou
%A Tzeng, Pei-Jer
%A Chang, Po-Chih
%A Chien, Chun-Hsien
%A Chang, Yiu-Hsiang
%A Chen, Shang-Chun
%A Hsin, Yu-Chen
%A Liao, Sue-Chen
%A Lin, Cha-Hsin
%A Ku, Tzu-Kun
%A Kao, Ming-Jer
%B 3DIC
%D 2013
%I IEEE
%K dblp
%P 1-5
%T Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#ChenLHCTCCCCHLLKK13
%@ 978-1-4673-6484-3
@inproceedings{conf/3dic/ChenLHCTCCCCHLLKK13,
added-at = {2017-05-21T00:00:00.000+0200},
author = {Chen, Jui-Chin and Lau, John H. and Hsu, Tzu-Chien and Chen, Chien-Chou and Tzeng, Pei-Jer and Chang, Po-Chih and Chien, Chun-Hsien and Chang, Yiu-Hsiang and Chen, Shang-Chun and Hsin, Yu-Chen and Liao, Sue-Chen and Lin, Cha-Hsin and Ku, Tzu-Kun and Kao, Ming-Jer},
biburl = {https://www.bibsonomy.org/bibtex/24962a0b361c28cf43d899e21c520d5cd/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2013},
ee = {https://doi.org/10.1109/3DIC.2013.6702335},
interhash = {b41ab659a6f7c9390d0724cb9985181b},
intrahash = {4962a0b361c28cf43d899e21c520d5cd},
isbn = {978-1-4673-6484-3},
keywords = {dblp},
pages = {1-5},
publisher = {IEEE},
timestamp = {2019-10-17T15:31:37.000+0200},
title = {Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#ChenLHCTCCCCHLLKK13},
year = 2013
}