%0 Conference Paper %1 conf/memsys/GraniPAY16 %A Grani, Paolo %A Proietti, Roberto %A Akella, Venkatesh %A Yoo, S. J. Ben %B MEMSYS %D 2016 %E Jacob, Bruce L. %I ACM %K dblp %P 377-386 %T Photonic Interconnects for Interposer-based 2.5D/3D Integrated Systems on a Chip. %U http://dblp.uni-trier.de/db/conf/memsys/memsys2016.html#GraniPAY16 %@ 978-1-4503-4305-3

@inproceedings{conf/memsys/GraniPAY16, added-at = {2022-04-09T00:00:00.000+0200}, author = {Grani, Paolo and Proietti, Roberto and Akella, Venkatesh and Yoo, S. J. Ben}, biburl = {https://www.bibsonomy.org/bibtex/2b5232990255061db9ed44772676b35ce/dblp}, booktitle = {MEMSYS}, crossref = {conf/memsys/2016}, editor = {Jacob, Bruce L.}, ee = {https://doi.org/10.1145/2989081.2989111}, interhash = {b9d5e90f574a3b5ed4e19407318adc19}, intrahash = {b5232990255061db9ed44772676b35ce}, isbn = {978-1-4503-4305-3}, keywords = {dblp}, pages = {377-386}, publisher = {ACM}, timestamp = {2024-04-10T20:27:58.000+0200}, title = {Photonic Interconnects for Interposer-based 2.5D/3D Integrated Systems on a Chip.}, url = {http://dblp.uni-trier.de/db/conf/memsys/memsys2016.html#GraniPAY16}, year = 2016 }