%0 Conference Paper %1 conf/3dic/ReedGGT10 %A Reed, Jason D. %A Goodwin, Scott H. %A Gregory, Christopher %A Temple, Dorota %B 3DIC %D 2010 %I IEEE %K dblp %P 1-8 %T Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#ReedGGT10 %@ 978-1-4577-0526-7

@inproceedings{conf/3dic/ReedGGT10, added-at = {2017-05-21T00:00:00.000+0200}, author = {Reed, Jason D. and Goodwin, Scott H. and Gregory, Christopher and Temple, Dorota}, biburl = {https://www.bibsonomy.org/bibtex/240d254f60edf15aed873067466d3e384/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2010}, ee = {https://doi.org/10.1109/3DIC.2010.5751434}, interhash = {bafa19bdbe1e03f5cfc724893922c371}, intrahash = {40d254f60edf15aed873067466d3e384}, isbn = {978-1-4577-0526-7}, keywords = {dblp}, pages = {1-8}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:46.000+0200}, title = {Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#ReedGGT10}, year = 2010 }