%0 Journal Article %1 journals/mr/GanH15a %A Gan, Chong Leong %A Hashim, Uda %D 2015 %J Microelectron. Reliab. %K dblp %N 11 %P 2481 %T Wafer-Level Chip-Scale Packaging (Analog and Power Electronics Packaging), XVII. Springer (2015), 322, ISBN: 978-1-4939-1555-2. %U http://dblp.uni-trier.de/db/journals/mr/mr55.html#GanH15a %V 55

@article{journals/mr/GanH15a, added-at = {2020-02-22T00:00:00.000+0100}, author = {Gan, Chong Leong and Hashim, Uda}, biburl = {https://www.bibsonomy.org/bibtex/2c3ceda7e481b279fda20a2a83f73ac0d/dblp}, ee = {https://doi.org/10.1016/j.microrel.2015.08.007}, interhash = {cf1cef45df21a172b482f2e83a3141a2}, intrahash = {c3ceda7e481b279fda20a2a83f73ac0d}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 11, pages = 2481, timestamp = {2020-02-25T13:22:12.000+0100}, title = {Wafer-Level Chip-Scale Packaging (Analog and Power Electronics Packaging), XVII. Springer (2015), 322, ISBN: 978-1-4939-1555-2.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr55.html#GanH15a}, volume = 55, year = 2015 }