%0 Journal Article %1 journals/computer/DaumBF93 %A Daum, Wolfgang %A Jr., William E. Burdick %A Fillion, Raymond A. %D 1993 %J Computer %K dblp %N 4 %P 23-29 %T Overlay High-Density Interconnect: A Chips-First Multichip Module Technology. %U http://dblp.uni-trier.de/db/journals/computer/computer26.html#DaumBF93 %V 26

@article{journals/computer/DaumBF93, added-at = {2020-08-12T00:00:00.000+0200}, author = {Daum, Wolfgang and Jr., William E. Burdick and Fillion, Raymond A.}, biburl = {https://www.bibsonomy.org/bibtex/2a9f5ce4b69bccc09f13686e355e6e62b/dblp}, ee = {http://doi.ieeecomputersociety.org/10.1109/2.206510}, interhash = {e712c7917a2be7009a5dffc23ec4204f}, intrahash = {a9f5ce4b69bccc09f13686e355e6e62b}, journal = {Computer}, keywords = {dblp}, number = 4, pages = {23-29}, timestamp = {2020-08-13T11:40:37.000+0200}, title = {Overlay High-Density Interconnect: A Chips-First Multichip Module Technology.}, url = {http://dblp.uni-trier.de/db/journals/computer/computer26.html#DaumBF93}, volume = 26, year = 1993 }