Inproceedings,
Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV.
K. Lee, C. Nagai, A. Nakamura, J. Bea, M. Murugesan, T. Fukushima, T. Tanaka, and M. Koyanagi.3DIC, page 1-4. IEEE, (2014)
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- conf/3dic/LeeNNBMFTK14
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- inproceedings
- booktitle
- 3DIC
- year
- 2014
- pages
- 1-4
- publisher
- IEEE
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- conf/3dic/2014
- ee
- https://doi.org/10.1109/3DIC.2014.7152153
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- 978-1-4799-8472-5
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- http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#LeeNNBMFTK14
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%1 conf/3dic/LeeNNBMFTK14
%A Lee, K. W.
%A Nagai, Chisato
%A Nakamura, Ai
%A Bea, Ji Chel
%A Murugesan, Mariappan
%A Fukushima, Takafumi
%A Tanaka, Tanaka
%A Koyanagi, Mitsumasa
%B 3DIC
%D 2014
%I IEEE
%K dblp
%P 1-4
%T Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#LeeNNBMFTK14
%@ 978-1-4799-8472-5
@inproceedings{conf/3dic/LeeNNBMFTK14,
added-at = {2017-07-13T00:00:00.000+0200},
author = {Lee, K. W. and Nagai, Chisato and Nakamura, Ai and Bea, Ji Chel and Murugesan, Mariappan and Fukushima, Takafumi and Tanaka, Tanaka and Koyanagi, Mitsumasa},
biburl = {https://www.bibsonomy.org/bibtex/2c8d915ca40b9dd356e871a54900c3868/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2014},
ee = {https://doi.org/10.1109/3DIC.2014.7152153},
interhash = {fda7aa5ad8ba60fb3276a83f5ea9aff9},
intrahash = {c8d915ca40b9dd356e871a54900c3868},
isbn = {978-1-4799-8472-5},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2017-07-14T11:41:32.000+0200},
title = {Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#LeeNNBMFTK14},
year = 2014
}