%0 Conference Paper %1 conf/3dic/KinoHTSIFKT15 %A Kino, Hisashi %A Hashiguchi, Hideto %A Tanikawa, Seiya %A Sugawara, Yohei %A Ikegaya, Shunsuke %A Fukushima, Takafumi %A Koyanagi, Mitsumasa %A Tanaka, Tetsu %B 3DIC %D 2015 %I IEEE %K dblp %P TS8.26.1-TS8.26.4 %T Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#KinoHTSIFKT15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/KinoHTSIFKT15, added-at = {2021-10-14T00:00:00.000+0200}, author = {Kino, Hisashi and Hashiguchi, Hideto and Tanikawa, Seiya and Sugawara, Yohei and Ikegaya, Shunsuke and Fukushima, Takafumi and Koyanagi, Mitsumasa and Tanaka, Tetsu}, biburl = {https://www.bibsonomy.org/bibtex/2017d046f1dc8dea15230968e15ab54b2/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334596}, interhash = {fccbd4abba1677b8ea1212de592a65f6}, intrahash = {017d046f1dc8dea15230968e15ab54b2}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS8.26.1-TS8.26.4}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:59.000+0200}, title = {Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#KinoHTSIFKT15}, year = 2015 }