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A 3D heterogeneous integration method using LTCC wafer for RF applications.

Xiaoyu Mi, Osamu Toyoda, Satoshi Ueda, and Fumihiko Nakazawa. 3DIC, page 1-5. IEEE, (2011)

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http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#MiTUN11
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conf/3dic/MiTUN11
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