%0 Conference Paper %1 conf/3dic/KimKKBJKKLP13 %A Kim, Jonghoon J. %A Kim, Heegon %A Kim, Sukjin %A Bae, Bumhee %A Jung, Daniel H. %A Kong, Sunkyu %A Kim, Joungho %A Lee, Junho %A Park, Kunwoo %B 3DIC %D 2013 %I IEEE %K dblp %P 1-4 %T Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#KimKKBJKKLP13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/KimKKBJKKLP13, added-at = {2017-05-21T00:00:00.000+0200}, author = {Kim, Jonghoon J. and Kim, Heegon and Kim, Sukjin and Bae, Bumhee and Jung, Daniel H. and Kong, Sunkyu and Kim, Joungho and Lee, Junho and Park, Kunwoo}, biburl = {https://www.bibsonomy.org/bibtex/24cc912a7ac48d98a53839d50a719b051/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702328}, interhash = {2ee3c42639ebf7fbb7a2b749a80c55a1}, intrahash = {4cc912a7ac48d98a53839d50a719b051}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#KimKKBJKKLP13}, year = 2013 }