%0 Journal Article %1 journals/qre/ChengCM15 %A Cheng, Hsin-En %A Chen, Rong-Sheng %A Mao, Chao-Yang %D 2015 %J Quality and Reliability Eng. Int. %K dblp %N 4 %P 543-566 %T Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls. %U http://dblp.uni-trier.de/db/journals/qre/qre31.html#ChengCM15 %V 31

@article{journals/qre/ChengCM15, added-at = {2015-06-15T00:00:00.000+0200}, author = {Cheng, Hsin-En and Chen, Rong-Sheng and Mao, Chao-Yang}, biburl = {https://www.bibsonomy.org/bibtex/257d883d1bc27e06358fb0ea834b5bcf6/dblp}, ee = {http://dx.doi.org/10.1002/qre.1611}, interhash = {ac8aa89373d2889393e51586e59ca187}, intrahash = {57d883d1bc27e06358fb0ea834b5bcf6}, journal = {Quality and Reliability Eng. Int.}, keywords = {dblp}, number = 4, pages = {543-566}, timestamp = {2015-06-18T00:52:40.000+0200}, title = {Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls.}, url = {http://dblp.uni-trier.de/db/journals/qre/qre31.html#ChengCM15}, volume = 31, year = 2015 }