%0 Conference Paper %1 conf/3dic/MatsumotoMO14 %A Matsumoto, Keiji %A Mori, Hiroyuki %A Orii, Yasumitsu %B 3DIC %D 2014 %I IEEE %K dblp %P 1-6 %T Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#MatsumotoMO14 %@ 978-1-4799-8472-5

@inproceedings{conf/3dic/MatsumotoMO14, added-at = {2017-05-21T00:00:00.000+0200}, author = {Matsumoto, Keiji and Mori, Hiroyuki and Orii, Yasumitsu}, biburl = {https://www.bibsonomy.org/bibtex/2bc9b815f7bdf23c15299e5394dac9803/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2014}, ee = {https://doi.org/10.1109/3DIC.2014.7152164}, interhash = {9efab31825a45eef1fb911c41882e36f}, intrahash = {bc9b815f7bdf23c15299e5394dac9803}, isbn = {978-1-4799-8472-5}, keywords = {dblp}, pages = {1-6}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:22.000+0200}, title = {Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#MatsumotoMO14}, year = 2014 }