%0 Conference Paper %1 conf/3dic/JungKKKKBC14 %A Jung, Daniel H. %A Kim, Heegon %A Kim, Jonghoon J. %A Kim, Sukjin %A Kim, Joungho %A Bae, Hyun-Cheol %A Choi, Kwang-Seong %B 3DIC %D 2014 %I IEEE %K dblp %P 1-5 %T Fault detection and isolation of multiple defects in through silicon via (TSV) channel. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#JungKKKKBC14 %@ 978-1-4799-8472-5

@inproceedings{conf/3dic/JungKKKKBC14, added-at = {2017-05-21T00:00:00.000+0200}, author = {Jung, Daniel H. and Kim, Heegon and Kim, Jonghoon J. and Kim, Sukjin and Kim, Joungho and Bae, Hyun-Cheol and Choi, Kwang-Seong}, biburl = {https://www.bibsonomy.org/bibtex/2c1f8caec57e1282f79ac644e90875c3c/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2014}, ee = {https://doi.org/10.1109/3DIC.2014.7152170}, interhash = {587cafe16377e51f246118e1ae9e6aae}, intrahash = {c1f8caec57e1282f79ac644e90875c3c}, isbn = {978-1-4799-8472-5}, keywords = {dblp}, pages = {1-5}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:22.000+0200}, title = {Fault detection and isolation of multiple defects in through silicon via (TSV) channel.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#JungKKKKBC14}, year = 2014 }