%0 Conference Paper %1 conf/3dic/LeeNNBMFTK14 %A Lee, K. W. %A Nagai, Chisato %A Nakamura, Ai %A Bea, Ji Chel %A Murugesan, Mariappan %A Fukushima, Takafumi %A Tanaka, Tanaka %A Koyanagi, Mitsumasa %B 3DIC %D 2014 %I IEEE %K dblp %P 1-4 %T Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#LeeNNBMFTK14 %@ 978-1-4799-8472-5

@inproceedings{conf/3dic/LeeNNBMFTK14, added-at = {2017-07-13T00:00:00.000+0200}, author = {Lee, K. W. and Nagai, Chisato and Nakamura, Ai and Bea, Ji Chel and Murugesan, Mariappan and Fukushima, Takafumi and Tanaka, Tanaka and Koyanagi, Mitsumasa}, biburl = {https://www.bibsonomy.org/bibtex/2c8d915ca40b9dd356e871a54900c3868/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2014}, ee = {https://doi.org/10.1109/3DIC.2014.7152153}, interhash = {fda7aa5ad8ba60fb3276a83f5ea9aff9}, intrahash = {c8d915ca40b9dd356e871a54900c3868}, isbn = {978-1-4799-8472-5}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2017-07-14T11:41:32.000+0200}, title = {Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#LeeNNBMFTK14}, year = 2014 }