%0 Conference Paper %1 conf/nems/KondoMLM15 %A Kondo, Masahiro %A Miyashita, Hidetoshi %A Lee, Sang-Seok %A Matsuoka, Nobuo %B NEMS %D 2015 %I IEEE %K dblp %P 487-490 %T Tentative bonding effect for maintaining alignment accuracy in bonding utilizing thick SU8 as an adhesive material. %U http://dblp.uni-trier.de/db/conf/nems/nems2015.html#KondoMLM15 %@ 978-1-4673-6695-3

@inproceedings{conf/nems/KondoMLM15, added-at = {2017-05-17T00:00:00.000+0200}, author = {Kondo, Masahiro and Miyashita, Hidetoshi and Lee, Sang-Seok and Matsuoka, Nobuo}, biburl = {https://www.bibsonomy.org/bibtex/2db1208efcf3e2bd4ad9f6bc0d74931df/dblp}, booktitle = {NEMS}, crossref = {conf/nems/2015}, ee = {https://doi.org/10.1109/NEMS.2015.7147474}, interhash = {cc9df48bdf63e07f0ab46f2c057836c9}, intrahash = {db1208efcf3e2bd4ad9f6bc0d74931df}, isbn = {978-1-4673-6695-3}, keywords = {dblp}, pages = {487-490}, publisher = {IEEE}, timestamp = {2019-10-17T22:13:47.000+0200}, title = {Tentative bonding effect for maintaining alignment accuracy in bonding utilizing thick SU8 as an adhesive material.}, url = {http://dblp.uni-trier.de/db/conf/nems/nems2015.html#KondoMLM15}, year = 2015 }