%0 Journal Article %1 journals/mr/YangLLZROTVW10 %A Yang, Y. %A Labie, Riet %A Ling, F. %A Zhao, C. %A Radisic, A. %A Olmen, Jan Van %A Travaly, Youssef %A Verlinden, Bert %A Wolf, Ingrid De %D 2010 %J Microelectron. Reliab. %K dblp %N 9-11 %P 1636-1640 %T Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures. %U http://dblp.uni-trier.de/db/journals/mr/mr50.html#YangLLZROTVW10 %V 50

@article{journals/mr/YangLLZROTVW10, added-at = {2020-02-22T00:00:00.000+0100}, author = {Yang, Y. and Labie, Riet and Ling, F. and Zhao, C. and Radisic, A. and Olmen, Jan Van and Travaly, Youssef and Verlinden, Bert and Wolf, Ingrid De}, biburl = {https://www.bibsonomy.org/bibtex/25a15ab691d24dd8fbb7cff597ba2845e/dblp}, ee = {https://doi.org/10.1016/j.microrel.2010.07.019}, interhash = {3029c8599b0e4fe45790f3c551f9c932}, intrahash = {5a15ab691d24dd8fbb7cff597ba2845e}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = {9-11}, pages = {1636-1640}, timestamp = {2020-02-25T13:23:10.000+0100}, title = {Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr50.html#YangLLZROTVW10}, volume = 50, year = 2010 }