Article,

Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module

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Journal of Electronic Materials, 42 (3): 372-381 (2013)
DOI: 10.1007/s11664-012-2366-1

Abstract

Thermoelectric modules experience performance reduction and mechanical failure due to thermomechanical stresses induced by thermal cycling. The present study subjects a thermoelectric module to thermal cycling and evaluates the evolution of its thermoelectric performance through measurements of the thermoelectric figure of merit,

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