%0 Journal Article %1 journals/mr/IshizakiYKSUOY15 %A Ishizaki, Toshitaka %A Yanase, Masashi %A Kuno, A. %A Satoh, T. %A Usui, Masanori %A Osawa, F. %A Yamada, Yasushi %D 2015 %J Microelectron. Reliab. %K dblp %N 7 %P 1060-1066 %T Thermal simulation of joints with high thermal conductivities for power electronic devices. %U http://dblp.uni-trier.de/db/journals/mr/mr55.html#IshizakiYKSUOY15 %V 55

@article{journals/mr/IshizakiYKSUOY15, added-at = {2022-04-01T00:00:00.000+0200}, author = {Ishizaki, Toshitaka and Yanase, Masashi and Kuno, A. and Satoh, T. and Usui, Masanori and Osawa, F. and Yamada, Yasushi}, biburl = {https://www.bibsonomy.org/bibtex/201c71580d533e82245e267b8a6fdb18b/dblp}, ee = {https://doi.org/10.1016/j.microrel.2015.04.005}, interhash = {320b9aa6faa1f3ce6fe3cfa5741b9363}, intrahash = {01c71580d533e82245e267b8a6fdb18b}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 7, pages = {1060-1066}, timestamp = {2024-04-09T02:50:36.000+0200}, title = {Thermal simulation of joints with high thermal conductivities for power electronic devices.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr55.html#IshizakiYKSUOY15}, volume = 55, year = 2015 }