%0 Journal Article %1 journals/mr/SchmitzSS11 %A Schmitz, Stefan %A Schneider-Ramelow, Martin %A Schröder, S. %D 2011 %J Microelectron. Reliab. %K dblp %N 1 %P 107-112 %T Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200 °C. %U http://dblp.uni-trier.de/db/journals/mr/mr51.html#SchmitzSS11 %V 51

@article{journals/mr/SchmitzSS11, added-at = {2020-02-22T00:00:00.000+0100}, author = {Schmitz, Stefan and Schneider-Ramelow, Martin and Schröder, S.}, biburl = {https://www.bibsonomy.org/bibtex/295c225b82e9dda24b922a6a9edee20da/dblp}, ee = {https://doi.org/10.1016/j.microrel.2010.07.062}, interhash = {3d95139aaffff2a94ca7ecbdfb42cdc3}, intrahash = {95c225b82e9dda24b922a6a9edee20da}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 1, pages = {107-112}, timestamp = {2020-02-25T13:26:06.000+0100}, title = {Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200 °C.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr51.html#SchmitzSS11}, volume = 51, year = 2011 }