%0 Journal Article %1 journals/tcad/TengCRK97 %A Teng, Chin-Chi %A Cheng, Yi-Kan %A Rosenbaum, Elyse %A Kang, Sung-Mo %D 1997 %J IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. %K dblp %N 8 %P 882-893 %T iTEM: a temperature-dependent electromigration reliability diagnosis tool. %U http://dblp.uni-trier.de/db/journals/tcad/tcad16.html#TengCRK97 %V 16

@article{journals/tcad/TengCRK97, added-at = {2020-09-24T00:00:00.000+0200}, author = {Teng, Chin-Chi and Cheng, Yi-Kan and Rosenbaum, Elyse and Kang, Sung-Mo}, biburl = {https://www.bibsonomy.org/bibtex/2ef525a582b622d2a745708d6a79231c3/dblp}, ee = {https://doi.org/10.1109/43.644613}, interhash = {5318046b204bc0e39a3c5a895555239e}, intrahash = {ef525a582b622d2a745708d6a79231c3}, journal = {IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.}, keywords = {dblp}, number = 8, pages = {882-893}, timestamp = {2020-09-25T11:45:41.000+0200}, title = {iTEM: a temperature-dependent electromigration reliability diagnosis tool.}, url = {http://dblp.uni-trier.de/db/journals/tcad/tcad16.html#TengCRK97}, volume = 16, year = 1997 }