%0 Journal Article %1 journals/ieicet/YoshidaTKSTT12 %A Yoshida, Satoshi %A Tanifuji, Shoichi %A Kameda, Suguru %A Suematsu, Noriharu %A Takagi, Tadashi %A Tsubouchi, Kazuo %D 2012 %J IEICE Trans. Electron. %K dblp %N 7 %P 1276-1284 %T 60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules. %U http://dblp.uni-trier.de/db/journals/ieicet/ieicet95c.html#YoshidaTKSTT12 %V 95-C

@article{journals/ieicet/YoshidaTKSTT12, added-at = {2020-04-11T00:00:00.000+0200}, author = {Yoshida, Satoshi and Tanifuji, Shoichi and Kameda, Suguru and Suematsu, Noriharu and Takagi, Tadashi and Tsubouchi, Kazuo}, biburl = {https://www.bibsonomy.org/bibtex/24c8e9565dd29c60084595b6010a55fae/dblp}, ee = {http://search.ieice.org/bin/summary.php?id=e95-c_7_1276}, interhash = {6f0bf986f73b52d551a96bacda827d1a}, intrahash = {4c8e9565dd29c60084595b6010a55fae}, journal = {IEICE Trans. Electron.}, keywords = {dblp}, number = 7, pages = {1276-1284}, timestamp = {2020-04-14T11:37:55.000+0200}, title = {60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules.}, url = {http://dblp.uni-trier.de/db/journals/ieicet/ieicet95c.html#YoshidaTKSTT12}, volume = {95-C}, year = 2012 }