%0 Conference Paper %1 conf/3dic/PrietoCCHCRDRFB16 %A Prieto, Rafael %A Coudrain, Perceval %A Colonna, Jean-Philippe %A Hallez, Y. %A Chancel, Christian %A Rat, V. %A Dumas, Sylvain %A Romano, G. %A Franiatte, R. %A Brunet-Manquiat, C. %A Cheramy, Séverine %A Farcy, Alexis %B 3DIC %D 2016 %I IEEE %K dblp %P 1-6 %T Heat spreading packaging solutions for hybrid bonded 3D-ICs. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#PrietoCCHCRDRFB16 %@ 978-1-5090-1399-9

@inproceedings{conf/3dic/PrietoCCHCRDRFB16, added-at = {2021-01-21T00:00:00.000+0100}, author = {Prieto, Rafael and Coudrain, Perceval and Colonna, Jean-Philippe and Hallez, Y. and Chancel, Christian and Rat, V. and Dumas, Sylvain and Romano, G. and Franiatte, R. and Brunet-Manquiat, C. and Cheramy, Séverine and Farcy, Alexis}, biburl = {https://www.bibsonomy.org/bibtex/2963f42b2b674bad2b3477a7a123b2f27/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2016}, ee = {https://doi.org/10.1109/3DIC.2016.7970038}, interhash = {8b1e367b419c4b2ce29de6413b79972d}, intrahash = {963f42b2b674bad2b3477a7a123b2f27}, isbn = {978-1-5090-1399-9}, keywords = {dblp}, pages = {1-6}, publisher = {IEEE}, timestamp = {2024-04-10T12:11:01.000+0200}, title = {Heat spreading packaging solutions for hybrid bonded 3D-ICs.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#PrietoCCHCRDRFB16}, year = 2016 }