%0 Journal Article %1 journals/mr/SethuNCOC15 %A Sethu, Raj Sekar %A Ng, Hong Seng %A Chan, Alvin %A Ong, Cheng Nee %A Chan, Sieng Fong %D 2015 %J Microelectron. Reliab. %K dblp %N 7 %P 1101-1108 %T Characterization of copper precipitates on aluminum copper bond pads formed after plasma clean and de-ionized water exposure. %U http://dblp.uni-trier.de/db/journals/mr/mr55.html#SethuNCOC15 %V 55

@article{journals/mr/SethuNCOC15, added-at = {2020-02-22T00:00:00.000+0100}, author = {Sethu, Raj Sekar and Ng, Hong Seng and Chan, Alvin and Ong, Cheng Nee and Chan, Sieng Fong}, biburl = {https://www.bibsonomy.org/bibtex/2f93679f445e408a7b0486de0ddb13400/dblp}, ee = {https://doi.org/10.1016/j.microrel.2015.03.018}, interhash = {966c0a17b92ab8772ba0af7cc047afa2}, intrahash = {f93679f445e408a7b0486de0ddb13400}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 7, pages = {1101-1108}, timestamp = {2020-02-25T13:30:08.000+0100}, title = {Characterization of copper precipitates on aluminum copper bond pads formed after plasma clean and de-ionized water exposure.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr55.html#SethuNCOC15}, volume = 55, year = 2015 }