%0 Conference Paper %1 conf/itc/BrozAR00 %A Broz, Jerry J. %A Andersen, James C. %A Rincon, Reynaldo M. %B ITC %D 2000 %I IEEE Computer Society %K dblp %P 477-484 %T Reducing device yield fallout at wafer level test with electrohydrodynamic (EHD) cleaning. %U http://dblp.uni-trier.de/db/conf/itc/itc2000.html#BrozAR00 %@ 0-7803-6546-1

@inproceedings{conf/itc/BrozAR00, added-at = {2023-03-23T00:00:00.000+0100}, author = {Broz, Jerry J. and Andersen, James C. and Rincon, Reynaldo M.}, biburl = {https://www.bibsonomy.org/bibtex/2cee665600e0b31357cd51eeb2e43424f/dblp}, booktitle = {ITC}, crossref = {conf/itc/2000}, ee = {https://doi.ieeecomputersociety.org/10.1109/TEST.2000.894240}, interhash = {a5e1ebb717dd60119442b109b7dfcc51}, intrahash = {cee665600e0b31357cd51eeb2e43424f}, isbn = {0-7803-6546-1}, keywords = {dblp}, pages = {477-484}, publisher = {IEEE Computer Society}, timestamp = {2024-04-10T04:28:46.000+0200}, title = {Reducing device yield fallout at wafer level test with electrohydrodynamic (EHD) cleaning.}, url = {http://dblp.uni-trier.de/db/conf/itc/itc2000.html#BrozAR00}, year = 2000 }