%0 Conference Paper %1 conf/3dic/KoHCCHFHCTCLC11 %A Ko, Cheng-Ta %A Hsiao, Zhi-Cheng %A Chang, Y. J. %A Chen, Peng-Shu %A Huang, J. H. %A Fu, Hsin-Chia %A Huang, Y. J. %A Chiang, C. W. %A Tsat, W. L. %A Chen, Y. H. %A Lo, Wei-Chung %A Chen, Kuan-Neng %B 3DIC %D 2011 %E Koyanagi, Mitsumasa %E Kada, Morihiro %I IEEE %K %P 1-4 %T Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#KoHCCHFHCTCLC11 %@ 978-1-4673-2189-1

@inproceedings{conf/3dic/KoHCCHFHCTCLC11, added-at = {2023-12-13T08:42:33.000+0100}, author = {Ko, Cheng-Ta and Hsiao, Zhi-Cheng and Chang, Y. J. and Chen, Peng-Shu and Huang, J. H. and Fu, Hsin-Chia and Huang, Y. J. and Chiang, C. W. and Tsat, W. L. and Chen, Y. H. and Lo, Wei-Chung and Chen, Kuan-Neng}, biburl = {https://www.bibsonomy.org/bibtex/2a2454b03c4d06efe5df16a9ac8e977f3/admin}, booktitle = {3DIC}, crossref = {conf/3dic/2011}, editor = {Koyanagi, Mitsumasa and Kada, Morihiro}, ee = {https://doi.org/10.1109/3DIC.2012.6262949}, interhash = {c67f5803c725ad4740b0d155ca75673f}, intrahash = {a2454b03c4d06efe5df16a9ac8e977f3}, isbn = {978-1-4673-2189-1}, keywords = {}, pages = {1-4}, publisher = {IEEE}, timestamp = {2023-12-13T08:42:33.000+0100}, title = {Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#KoHCCHFHCTCLC11}, year = 2011 }