Please log in to take part in the discussion (add own reviews or comments).
Cite this publication
More citation styles
- please select -
%0 Conference Paper
%1 conf/3dic/NishizawaASSI13
%A Nishizawa, S.
%A Arima, Ryohei
%A Shimizu, Tomohiro
%A Shingubara, Shoso
%A Inoue, Fumihiro
%B 3DIC
%D 2013
%I IEEE
%K dblp
%P 1-4
%T Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#NishizawaASSI13
%@ 978-1-4673-6484-3
@inproceedings{conf/3dic/NishizawaASSI13,
added-at = {2017-05-21T00:00:00.000+0200},
author = {Nishizawa, S. and Arima, Ryohei and Shimizu, Tomohiro and Shingubara, Shoso and Inoue, Fumihiro},
biburl = {https://www.bibsonomy.org/bibtex/23ed9ffb7fdfcfa7ed970b29f929e29fa/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2013},
ee = {https://doi.org/10.1109/3DIC.2013.6702392},
interhash = {f35ae4b62eec4e41513b318609955d9b},
intrahash = {3ed9ffb7fdfcfa7ed970b29f929e29fa},
isbn = {978-1-4673-6484-3},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2019-10-17T15:31:37.000+0200},
title = {Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#NishizawaASSI13},
year = 2013
}