%0 Conference Paper %1 conf/3dic/ReddyTSS15 %A Reddy, R. Ranga %A Tanna, Sugandh %A Singh, Shiv Govind %A Singh, Om Krishna %B 3DIC %D 2015 %I IEEE %K dblp %P TS8.35.1-TS8.35.5 %T TSV noise coupling in 3D IC using guard ring. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#ReddyTSS15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/ReddyTSS15, added-at = {2017-05-21T00:00:00.000+0200}, author = {Reddy, R. Ranga and Tanna, Sugandh and Singh, Shiv Govind and Singh, Om Krishna}, biburl = {https://www.bibsonomy.org/bibtex/245036298c7ee06998d11ce06cc5bdb97/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334606}, interhash = {fbc12ccafc515fac86feab2ff67021d7}, intrahash = {45036298c7ee06998d11ce06cc5bdb97}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS8.35.1-TS8.35.5}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {TSV noise coupling in 3D IC using guard ring.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#ReddyTSS15}, year = 2015 }