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A 1.2V 0.2-to-6.3GHz Transceiver with Less Than -29.5dB EVM@-3dBm and a Choke/Coil-Less Pre-Power Amplifier., , , , , , and . ISSCC, page 214-215. IEEE, (2008)A fully integrated 2×1 dual-band direct-conversion transceiver with dual-mode fractional divider and noise-shaping TIA for mobile WiMAX SoC in 65nm CMOS., , , , , , , , , and 3 other author(s). ISSCC, page 456-457. IEEE, (2010)A conditional clocking flip-flop for low power H.264/MPEG-4 audio/visual codec LSI., , , , , , , , , and 1 other author(s). CICC, page 527-530. IEEE, (2005)Introduction to the Special Section on the 2019 Asian Solid-State Circuits Conference (A-SSCC)., , and . IEEE J. Solid State Circuits, 55 (10): 2627-2628 (2020)Wireless power transfer to stacked modules for IoT sensor nodes., , , , and . ISOCC, page 59-60. IEEE, (2017)A 0.13 µm CMOS Bluetooth EDR Transceiver with High Sensitivity over Wide Temperature Range and Immunity to Process Variation., , , , , , , , , and 7 other author(s). IEICE Trans. Electron., 93-C (6): 803-811 (2010)A Low-Noise and Highly-Linear Transmitter with Envelope Injection Pre-Power Amplifier for Multi-Mode Radio., , , , , , and . IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 94-A (2): 592-602 (2011)A 7-nm FinFET 1.2-TB/s/mm2 3D-Stacked SRAM Module With 0.7-pJ/b Inductive Coupling Interface Using Over-SRAM Coil and Manchester-Encoded Synchronous Transceiver., , , , and . IEEE J. Solid State Circuits, 58 (7): 2075-2086 (2023)A 17-mW 0.66-mm2 direct-conversion receiver for 1-Mb/s cable replacement., , , and . IEEE J. Solid State Circuits, 40 (12): 2547-2554 (2005)Low-power CMOS digital design with dual embedded adaptive power supplies., and . IEEE J. Solid State Circuits, 35 (4): 652-655 (2000)