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Image Quality Issues for High Resolution TFTLCDs.

, , , , , and . CIC, page 100-105. Society for Imaging Science and Technology, (1998)

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Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection., , , , , , , , , and 10 other author(s). IBM J. Res. Dev., 49 (4-5): 725-754 (2005)Status of TFTLCD Color and Metrology., , and . CIC, page 301-304. Society for Imaging Science and Technology, (2000)Active line repair for thin-film-transistor liquid crystal displays., , , , , , and . IBM J. Res. Dev., 42 (3): 445-458 (1998)Image Quality Issues for High Resolution TFTLCDs., , , , , and . CIC, page 100-105. Society for Imaging Science and Technology, (1998)Colorimetric Tolerances of Various Digital Image Displays., , and . CIC, page 295-300. Society for Imaging Science and Technology, (2000)Liquid-crystal displays for medical imaging: a discussion of monochrome versus color., and . Medical Imaging: Image-Guided Procedures, volume 5367 of SPIE Proceedings, SPIE, (2004)3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections., , , , , , , , , and 3 other author(s). IBM J. Res. Dev., 52 (6): 611-622 (2008)Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology., , , , , , , , , and 5 other author(s). CICC, page 659-662. IEEE, (2005)Multiple images viewable on twisted-nematic mode liquid-crystal displays., , and . IEEE Signal Process. Lett., 10 (8): 225-227 (2003)Fabrication and characterization of robust through-silicon vias for silicon-carrier applications., , , , , , and . IBM J. Res. Dev., 52 (6): 571-581 (2008)