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Co-design of 3D wireless network-on-chip architectures with microchannel-based cooling.

, , , , , and . IGSC, page 1-6. IEEE Computer Society, (2015)

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Increasing interposer utilization: A scalable, energy efficient and high bandwidth multicore-multichip integration solution., , , , and . IGSC, page 1-6. IEEE Computer Society, (2017)A Wireless Interconnection Framework for Seamless Inter and Intra-Chip Communication in Multichip Systems., , , , , and . IEEE Trans. Computers, 66 (3): 389-402 (2017)Interference-Aware Wireless Network-on-Chip Architecture Using Directional Antennas., , , , and . IEEE Trans. Multi Scale Comput. Syst., 3 (3): 193-205 (2017)An Interconnection Architecture for Seamless Inter and Intra-Chip Communication Using Wireless Links., , and . NOCS, page 2:1-2:8. ACM, (2015)A Traffic-Aware Medium Access Control Mechanism for Energy-Efficient Wireless Network-on-Chip Architectures., , , , , and . CoRR, (2018)Intra-chip Wireless Interconnect: The Road Ahead., , , , , , and . NoCArc@MICRO, page 3:1-3:6. ACM, (2017)Co-design of 3D wireless network-on-chip architectures with microchannel-based cooling., , , , , and . IGSC, page 1-6. IEEE Computer Society, (2015)Temperature-aware wireless network-on-chip architecture., , , , and . IGCC, page 1-10. IEEE Computer Society, (2014)A 0.36pJ/bit, 17Gbps OOK receiver in 45-nm CMOS for inter and intra-chip wireless interconnects., , , , , and . SoCC, page 132-137. IEEE, (2017)A folded wireless network-on-chip using graphene based THz-band antennas., , , and . NANOCOM, page 29:1-29:6. ACM, (2017)