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Sidelobe Blanking with Expanded Models.

, and . IEEE Trans. Aerosp. Electron. Syst., 47 (2): 790-805 (2011)

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Multipass communication systems for tiled processor architectures.. Massachusetts Institute of Technology, Cambridge, MA, USA, (2006)ndltd.org (oai:dspace.mit.edu:1721.1/36137).Sidelobe Blanking with Expanded Models., and . IEEE Trans. Aerosp. Electron. Syst., 47 (2): 790-805 (2011)