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Disambiguation of "Oprins, Herman"

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Thermal experimental and modeling analysis of high power 3D packages.

, , , , , and . ICICDT, page 1-4. IEEE, (2015)

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Herman Vloed

Herman Hahlo

Herman Lubenstein

Herman Widjaja

Herman Kuipers

 

Other publications of authors with the same name

Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC., , , , , , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 31 (12): 1896-1904 (December 2023)Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling., , , , and . Microelectron. J., 39 (7): 966-974 (2008)Thermal experimental and modeling analysis of high power 3D packages., , , , , and . ICICDT, page 1-4. IEEE, (2015)Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications., , , , , , , , and . IRPS, page 1-4. IEEE, (2019)Fine grain thermal modeling and experimental validation of 3D-ICs., , , , , , , , , and . Microelectron. J., 42 (4): 572-578 (2011)New fast distributed thermal model for analysis of GaN based power devices., , , , , and . ESSDERC, page 172-175. IEEE, (2016)Towards accurate temperature prediction in BEOL for reliability assessment (Invited)., , , , , , , , , and 1 other author(s). IRPS, page 1-7. IEEE, (2023)Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions., , , , , , , , , and 8 other author(s). CICC, page 1-4. IEEE, (2010)Design issues and considerations for low-cost 3D TSV IC technology., , , , , , , , , and 24 other author(s). ISSCC, page 148-149. IEEE, (2010)Design Issues and Considerations for Low-Cost 3-D TSV IC Technology., , , , , , , , , and 27 other author(s). IEEE J. Solid State Circuits, 46 (1): 293-307 (2011)