( en | de | ru )

 

Disambiguation of "Davis, W. Rhett"

Author of the publication

copydeleteadd this publication to your clipboard
Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks.

, , , , , , and . 3DIC, page TS10.2.1-TS10.2.4. IEEE, (2015)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Rhett Jäckel

Rhett Kempe

Matthew Davis

Rhett Kempe

Geoffrey Davis

 

Other publications of authors with the same name

A 500-Mb/s soft-output Viterbi decoder., , , and . IEEE J. Solid State Circuits, 38 (7): 1234-1241 (2003)Design and CAD for 3D integrated circuits., , , , , , , , , and 2 other author(s). DAC, page 668-673. ACM, (2008)Creating 3D specific systems: Architecture, design and CAD., , and . DATE, page 1684-1688. IEEE Computer Society, (2010)3D-enabled customizable embedded computer (3DECC)., , , , , , , , , and 2 other author(s). 3DIC, page 1-3. IEEE, (2014)Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks., , , , , , and . 3DIC, page TS10.2.1-TS10.2.4. IEEE, (2015)A design environment for high-throughput low-power dedicated signal processing systems., , , , , , , , , and . IEEE J. Solid State Circuits, 37 (3): 420-431 (2002)Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits., , , and . 3DIC, page 1-3. IEEE, (2014)Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration., , , and . ACM Trans. Design Autom. Electr. Syst., 16 (1): 5:1-5:25 (2010)Automated Design Space Exploration for DSP Applications., , , and . J. Signal Process. Syst., 56 (2-3): 199-216 (2009)Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning., , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 31 (10): 1522-1535 (2012)