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An Analytical, Temperature-dependent Model for Majority- and Minority-carrier Mobility in Silicon Devices., , , , and . VLSI Design, 10 (4): 467-483 (2000)On the Structure and Closure-Condition of the Hydrodynamic Model., and . VLSI Design, 3 (2): 115-129 (1995)TCAD modeling of encapsulation layer in high-voltage, high-temperature operation regime., , , , , , and . ESSDERC, page 325-328. IEEE, (2014)Gate stack optimization to minimize power consumption in super-lattice fets., , , , and . ESSDERC, page 81-84. IEEE, (2013)Sensitivity Analysis for Device Design., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 6 (5): 879-885 (1987)Numerical modeling of advanced semiconductor devices., , , , , , , , , and . IBM J. Res. Dev., 36 (2): 208-232 (1992)A photodiode cell for applications to position and motion estimation sensors., , , and . IEEE Trans. Ind. Electron., 43 (1): 200-206 (1996)A novel metric for nearest-neighbor classification of hand-written digits., , and . ICPR (2), page 96-100. IEEE, (1992)Three-dimensional simulation of VLSI structures., , , and . Eur. Trans. Telecommun., 1 (3): 301-306 (1990)TCAD study of DLC coatings for large-area high-power diodes., , , , , , , and . Microelectron. Reliab., (2018)