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Rotary traveling-wave oscillator arrays: a new clock technology., , and . IEEE J. Solid State Circuits, 36 (11): 1654-1665 (2001)A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration., , and . CICC, page 1-4. IEEE, (2012)Exploring early design tradeoffs in 3DIC., , , , and . ISCAS, page 545-549. IEEE, (2013)Design and CAD for 3D integrated circuits., , , , , , , , , and 2 other author(s). DAC, page 668-673. ACM, (2008)3D-enabled customizable embedded computer (3DECC)., , , , , , , , , and 2 other author(s). 3DIC, page 1-3. IEEE, (2014)Physical design of a 3D-stacked heterogeneous multi-core processor., , , , , , , and . 3DIC, page 1-5. IEEE, (2016)Rationale for a 3D heterogeneous multi-core processor., , , , , , , , , and . ICCD, page 154-168. IEEE Computer Society, (2013)Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning., , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 30 (9): 1230-1243 (2022)H3 (Heterogeneity in 3D): A Logic-on-Logic 3D-Stacked Heterogeneous Multi-Core Processor., , , , , , , , , and 1 other author(s). ICCD, page 145-152. IEEE Computer Society, (2017)Computing in 3D., , , , , , , , , and 2 other author(s). 3DIC, page TS6.1.1-TS6.1.2. IEEE, (2015)