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Optimized integrated micro-hotplates in CMOS technology., , , , , , , , and . NEWCAS, page 1-4. IEEE, (2013)Through Silicon Via (TSV) defect investigations using lateral emission microscopy., , , and . Microelectron. Reliab., 50 (9-11): 1413-1416 (2010)Metallization defect detection in 3D integrated components using scanning acoustic microscopy and acoustic simulations., , , , , , and . Microelectron. Reliab., (2018)Bimetallic nanoparticles for optimizing CMOS integrated SnO2 gas sensor devices., , , , , , , , , and 1 other author(s). ESSDERC, page 78-81. IEEE, (2014)Thermal transient measurement and modelling of a power cycled flip-chip LED module., , , , , , , , , and . Microelectron. Reliab., (2018)Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation., , , , , , , and . Microelectron. Reliab., (2017)Manufacturing of 3D integrated sensors and circuits., , , , , , and . ESSDERC, page 162-165. IEEE, (2014)Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy., , , , , , , and . Microelectron. Reliab., (2016)Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation., , , , , , , , and . Microelectron. Reliab., (2017)Parameter driven monitoring for a flip-chip LED module under power cycling condition., , , , , , , and . Microelectron. Reliab., (2018)