Author of the publication

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Reliability Challenges Related to TSV Integration and 3-D Stacking.

K. Croes, J. Messemaeker, Y. Li, W. Guo, O. Pedreira, V. Cherman, M. Stucchi, I. Wolf, and E. Beyne. IEEE Des. Test, 33 (3): 37-45 (2016)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Ingrid Wolf

Other publications of authors with the same name

MEMS reliability.I. Wolf. Microelectron. Reliab., 43 (7): 1047-1048 (2003)Editorial.G. Groeseneken, I. Wolf, A. Mouthaan, and J. Bisschop. Microelectron. Reliab., 48 (8-9): 1111 (2008)Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis.A. Khaled, S. Brand, M. Kögel, T. Appenroth, and I. Wolf. Microelectron. Reliab., (2016)Wafer-Level Aging of InGaAs/GaAs Nano-Ridge p-i-n Diodes Monolithically Integrated on Silicon.P. Hsieh, A. Tsiara, B. O'Sullivan, D. Yudistira, M. Baryshnikova, G. Groeseneken, B. Kunert, M. Pantouvaki, J. Campenhout, and I. Wolf. IRPS, page 9. IEEE, (2022)Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.Y. Ding, O. Pedreira, M. Lofrano, H. Zahedmanesh, T. Chavez, H. Farr, I. Wolf, and K. Croes. IRPS, page 1-7. IEEE, (2023)Impact of Mechanical Stress on the Electrical Performance of 3D NAND.A. Kruv, A. Arreghini, M. Gonzalez, D. Verreck, G. den Bosch, I. Wolf, and A. Furnémont. IRPS, page 1-5. IEEE, (2019)Impact of design factors and environment on the ESD sensitivity of MEMS micromirrors.S. Sangameswaran, J. Coster, G. Groeseneken, and I. Wolf. Microelectron. Reliab., 50 (9-11): 1383-1387 (2010)Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.G. der Plas, P. Limaye, I. Loi, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti and 27 other author(s). IEEE J. Solid State Circuits, 46 (1): 293-307 (2011)Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.L. Kljucar, M. Gonzalez, I. Wolf, K. Croes, J. Bömmels, and Z. Tökei. Microelectron. Reliab., (2016)Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.L. Kljucar, M. Gonzalez, K. Croes, I. Wolf, J. Messemaeker, G. Murdoch, P. Nolmans, J. Vos, J. Bömmels, E. Beyne and 1 other author(s). Microelectron. Reliab., (2017)

BibSonomy

Disambiguation of "Wolf, Ingrid De"

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Reliability Challenges Related to TSV Integration and 3-D Stacking.

Please choose a person to relate this publication to

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Wolf, Ingrid De"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Reliability Challenges Related to TSV Integration and 3-D Stacking.

Please choose a person to relate this publication to

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Ingrid Wolf

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Reliability Challenges Related to TSV Integration and 3-D Stacking.