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Evaluation of a Portable fMRI Compatible Robotic Wrist Interface., , , , and . EMBC, page 2535-2539. IEEE, (2022)Contact-based navigation for an autonomous flying robot., , , , , , and . IROS, page 3987-3992. IEEE, (2013)2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters., , , , , , , , , and 18 other author(s). ISSCC, page 46-48. IEEE, (2020)Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration., , , , , , , , , and 2 other author(s). 3DIC, page 1-7. IEEE, (2013)IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management., , , , , , , , , and 18 other author(s). IEEE J. Solid State Circuits, 56 (1): 79-97 (2021)Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement., , , , , , , , , and 3 other author(s). 3DIC, page TS1.4.1-TS1.4.8. IEEE, (2015)