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Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling., , , , , , and . Microelectron. Reliab., 53 (8): 1111-1116 (2013)Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology., , , , and . ECOC, page 1-3. IEEE, (2014)The influence of liners with Ti, Ta or Ru finish on thin Cu films., , , and . Microelectron. Reliab., 54 (9-10): 1877-1882 (2014)Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor., , , , , , and . IEEE SENSORS, page 1-4. IEEE, (2021)Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography., , , , and . Microelectron. Reliab., (2017)Optimization Parameters for Laser-induced Forward Transfer of Al and Cu on Si-wafer Substrate., , , and . PHOTOPTICS, page 228-231. SCITEPRESS, (2018)Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars., , , , , and . Microelectron. Reliab., (2016)High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach., , , , and . Microelectron. Reliab., (2016)Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensors for Measurements in Harsh Environments., , , and . Sensors, 15 (8): 20305-20315 (2015)From fan-out wafer to fan-out panel level packaging., , , , , , , , , and . ECCTD, page 1-4. IEEE, (2015)