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A 0.13μm 64Mb HfOx ReRAM using configurable ramped voltage write and low read-disturb sensing techniques for reliability improvement.

, , , , , , , , , , , , , , , , , , , , , , , , and . CICC, page 1-4. IEEE, (2017)

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A 0.13μm 64Mb HfOx ReRAM using configurable ramped voltage write and low read-disturb sensing techniques for reliability improvement., , , , , , , , , and 15 other author(s). CICC, page 1-4. IEEE, (2017)A 9Mb HZO-Based Embedded FeRAM with 1012-Cycle Endurance and 5/7ns Read/Write using ECC-Assisted Data Refresh and Offset-Canceled Sense Amplifier., , , , , , , , , and 2 other author(s). ISSCC, page 498-499. IEEE, (2023)A Low Power 4T2C nvSRAM With Dynamic Current Compensation Operation Scheme., , , , , , , , , and 2 other author(s). IEEE Trans. Very Large Scale Integr. Syst., 28 (11): 2469-2473 (2020)Ion-Gated Transistor: An Enabler for Sensing and Computing Integration., , , , , and . Adv. Intell. Syst., 2 (12): 2000156 (2020)High-Density 3-D Stackable Crossbar 2D2R nvTCAM With Low-Power Intelligent Search for Fast Packet Forwarding in 5G Applications., , , , , , , , and . IEEE J. Solid State Circuits, 56 (3): 988-1000 (2021)A 9-Mb HZO-Based Embedded FeRAM With 10-Cycle Endurance and 5/7-ns Read/Write Using ECC-Assisted Data Refresh and Offset-Canceled Sense Amplifier., , , , , , , , , and 1 other author(s). IEEE J. Solid State Circuits, 59 (1): 208-218 (January 2024)Resistive Switching Devices: Mechanism, Performance and Integration., , , and . Handbook of Memristor Networks, Springer, (2019)A High Reliability 500 µW Resistance-to-Digital Interface Circuit for SnO2 Gas Sensor IoT Applications., , , , , , , and . ASICON, page 1-4. IEEE, (2019)A 28 nm 512 Kb adjacent 2T2R RRAM PUF with interleaved cell mirroring and self-adaptive splitting for high density and low BER cryptographic key in IoT devices., , , , , and . Microelectron. J., (2022)Investigation of weight updating modes on oxide-based resistive switching memory synapse towards neuromorphic computing applications., , , , , , , , , and 1 other author(s). Sci. China Inf. Sci., (2021)