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A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections., , , , , , , and . Microelectron. Reliab., 45 (3-4): 517-525 (2005)On Wafer-Packing Problems., , and . IEEE Trans. Computers, 42 (11): 1382-1388 (1993)A nonlinear Krein Rutman theorem.. J. Syst. Sci. Complex., 22 (4): 542-554 (2009)Implementation of a Multi-band Pulsed-OFDM Transceiver., , , and . J. VLSI Signal Process., 43 (1): 73-88 (2006)A preprocessor for the via minimization problem., and . DAC, page 702-707. IEEE Computer Society Press, (1986)Layer Assignment Problem for Three-Layer Routing., and . IEEE Trans. Computers, 37 (5): 625-632 (1988)Comment on "Event suppression by optimizing VHDL programs".. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 18 (9): 1400-1401 (1999)Efficient Algorithms for Layer Assignment Problem., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 6 (1): 67-78 (1987)Quick travel planning and travel book editing system., , , , , , , and . MISNC, page 31:1-31:4. ACM, (2017)Including HDL and synthesis in the EE and CSE digital design curriculum.. MSE, page 125-126. IEEE Computer Society, (1997)