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Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling.

Y. Peng, T. Song, D. Petranovic, and S. Lim. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 33 (12): 1900-1913 (2014)

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Xiao-Wei Peng

Changgeng Peng

Martin Peng

Jianqiang Peng

Guo Peng

Other publications of authors with the same name

Full-Chip Signal Integrity Analysis and Optimization of 3-D ICs.T. Song, C. Liu, Y. Peng, and S. Lim. IEEE Trans. Very Large Scale Integr. Syst., 24 (5): 1636-1648 (2016)Design Challenges of Intrachiplet and Interchiplet Interconnection.C. Chen, J. Yin, Y. Peng, M. Palesi, W. Cao, L. Huang, A. Singh, H. Zhi, and X. Wang. IEEE Des. Test, 39 (6): 99-109 (2022)Coupling Extraction and Optimization for Heterogeneous 2.5D Chiplet-Package Co-Design.M. Kabir, D. Petranovic, and Y. Peng. ICCAD, page 3:1-3:8. IEEE, (2020)Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs.T. Song, C. Liu, Y. Peng, and S. Lim. DAC, page 180:1-180:7. ACM, (2013)A Framework of Total Performance Improvement and Transaction Cost-driven Business Process Outsourcing Strategy.Y. Peng, and W. Hou. PACIS, page 76. AISeL, (2004)Hierarchical Layout Synthesis and Optimization Framework for High-Density Power Module Design Automation.I. Razi, Q. Le, H. Mantooth, and Y. Peng. ICCAD, page 1-8. IEEE, (2021)Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded 3D ICs.Y. Peng, T. Song, D. Petranovic, and S. Lim. ICCAD, page 649-655. IEEE, (2015)Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-Design.M. Kabir, D. Petranovic, and Y. Peng. ACM Great Lakes Symposium on VLSI, page 135-140. ACM, (2021)Holistic and In-Context Design Flow for 2.5D Chiplet-Package Interaction Co-Optimization.M. Kabir, W. Hung, T. Ho, and Y. Peng. VLSI-DAT, page 1-4. IEEE, (2021)Multi-TSV and E-Field Sharing Aware Full-chip Extraction and Mitigation of TSV-to-Wire Coupling.Y. Peng, D. Petranovic, and S. Lim. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 34 (12): 1964-1976 (2015)

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Disambiguation of "Peng, Yarui"

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Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling.

Please choose a person to relate this publication to

Xiao-Wei Peng

Changgeng Peng

Martin Peng

Jianqiang Peng

Guo Peng

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Peng, Yarui"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling.

Please choose a person to relate this publication to

Xiao-Wei Peng

Changgeng Peng

Martin Peng

Jianqiang Peng

Guo Peng

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling.